# Big Picture *(circa Q1 2012)* The generic term "System on a Chip" refers to the fact that the CPU and many "peripherals" (USB, ethernet, memory controller, GPU) are integraded into a single package instead of being distributed across a motherboard via a northbridge and southbridge. There still needs to be external analog and digital circuitry for most "connectivity" interfaces like USB or ethernet to provide level conversion, isolation, etc. Notably, RAM is not usually integraded into the chip, and the large parallel bus to the RAM chips must be routed very carefully. Some newer chips (popular circa 2010?) include "package on package" technology where the RAM chip is right on top of the SoC to make routing easier (eg, iPhones, RaspberryPI). The establishment players for mobile ARM SoCs are TI (OMAP), Qualcomm ([Snapdragon](http://en.wikipedia.org/wiki/Snapdragon_(System_on_Chip))), not regular ARM), Samsung ([Exynos](http://en.wikipedia.org/wiki/Exynos))), Broadcom (Armada, Armada XP, ) The establishment players for MIPS SoCs are Broadcom and Marvell (Kirkwood). # ARM ### TI OMAP [OMAP5 overview](http://www.linuxfordevices.com/c/a/News/TI-OMAP5430-and-OMAP5432-CES-demos/) ### Marvell Armada XP eg, MV78260 samples available from nu horizons: apple experimenting with these chip? ### Calxeda "EnergyCore" ECX-1000 is 4 Cortex-A9 at 1.1-1.4ghz, 5watts with 4gb DDR3 RAM. Going for massively parallelized market, with hundreds of cors in a rack. # MIPS Ingenic jz4760B # x86 # PowerPC AppliedMicro APM86290 # Other Marvell Avanta ethernet switch SoCs: http://www.marvell.com/broadband/ Marvell Prestera EX/MX enterprise packet processors Freescale QorIQ DPAA